Supply and Installation of iBond 5000 Wedge Bonder System with Microscope and Bonding Accessories
AwardedSupply of an iBond 5000 manual ultrasonic wedge bonder for microelectronics and semiconductor packaging applications, including an Olympus stereo zoom microscope, deep-access wire and ribbon bonding clamp assemblies, heated workholder…
- Closing date
- Not stated
- Buyer's estimated value
- Not stated
- Where
- UK-wide Buyer based in Teddington